18W/mK Thermal Putty for GPU VARM,12g Thermal Pad Replacement | Non-Conductive Gap Filler ,High Performance Thermal Putty for Laptop Gamer/PS4/PS5/Xbox/VGA/IC Processor/PCB
US$5.60
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US$5.60
Price when purchased online
Free shipping
Free 30-day returns
Sold and shipped by www.anniebeacon.org
Free 30-day returns Details
Product details
| Management number | 247735710 | Release Date | 2026/08/16 | List Price | US$5.60 | Model Number | 247735710 | ||
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- 18W/mK THERMAL CONDUCTIVITY: FEHONDA Thermal Putty GPU formulated with high-content premium high thermal conductivity fillers, helps solve CPU thermal throttling and maintain the PC's full-load stability. ideal for replacing traditional thermal pads in GPU modifications. It can be applied at a thickness as thin as 0.2–0.3 mm, effectively fills uneven micro-gaps between processors and heatsinks to ensure optimal heat dissipation.
- WIDE COMPATIBILITY: The wide working temperature range (-40℃-180℃) of the 12g Thermal Putty & its Insulation properties make it suitable for all electronic components in need of heat dissipation, such as for CPUs, GPUs, Xbox, processors, SSDs, PCBs, RAM, VRAM, graphics card and for PS4/PS5 consoles.
- EASY APPLICATION: It is easy to apply with a spatula or a finger sleeve. Its viscosity ensures it spreads smoothly and evenly for a consistent layer across the surface. Recommend using latex gloves to shape the paste into balls or discs and then apply them where needed
- STABLE HEAT DISSIPATION: The Thermal Putty Laptop's low-volatility silicone oil formulation resists oil-powder separation and evaporation, as demonstrated by a 1000+ hour thermal shock test with no drying, no cracking, and no sagging.Ensuring long-term, stable heat dissipation performance,has a long operational life time.
- FEHONDA BRAND ASSURANCE: 19 years of dedication to thermal putty technology, trusted by top enterprises like BYD, DJI, and Huawei. Certified as a National High-Tech Enterprise, adhering to strict quality standards. Giving you peace of mind for industrial and electronic applications
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